SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus is provided to reduce remarkably a tact time by reducing a performance time of an air knife using an enhanced nozzle arrangement. A substrate processing apparatus includes a process solution supply unit and a dry unit. The process solution supply unit and the dry unit are sequentially arranged according to a direction of transferring a substrate. The dry unit is composed of an air knife(20) capable of drying a process solution on a substrate. The process supply unit includes a plurality of nozzles capable of supplying the process solution onto the substrate. At least rearmost one out of the plurality of nozzles is installed opposite to a direction of transferring the substrate.