发明名称 APPARATUS FOR TREATING SUBSTRATES
摘要 An apparatus for treating a substrate is provided to prevent the contamination of a working place, corrosion of the apparatus, and accidents by blocking the leakage of toxic and corrosive exhaust gas. An apparatus for treating a substrate includes a treating chamber(100), an inner tube, an outer tube, a flange, a gas supply pipe(140), a cooling unit(200), and an exhausting pipe(150). The inner tube is cylindrical, has opened top and bottom, and is installed inside the treating chamber(100). The outer tube embraces the inner tube by being spaced apart from the inner tube. The flange supports the inner tube and the outer tube. The gas supply pipe and the exhausting pipe are connected to the flange. The gas supply pipe supplies the treating chamber with reaction gas to be used in a process. The exhausting pipe exhausts the by-product of reaction inside the treating chamber. A heater is installed on the outer side of the outer tube to maintain the treating chamber in high temperature.
申请公布号 KR20070101453(A) 申请公布日期 2007.10.17
申请号 KR20060032457 申请日期 2006.04.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, HOON SOON
分类号 H01L21/02 主分类号 H01L21/02
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