RESIN COMPOSITION CONTAINING CATALYSTIC PRECURSOR FOR ELECTROLESS PLATING IN PREPARING ELECTRO-MAGENTIC SHIELDING LAYER, FORMING METHOD OF METALLIC PATTEN USING THE SAME AND METALLIC PATTERN FORMED THEREBY

摘要

A catalyst precursor resin composition for electromagnetic interference shielding, a method for forming a metal pattern by using the composition, a metal pattern formed by the method, and an electromagnetic interference shielding material containing the metal pattern are provided to improve the adhesion of a catalyst layer and plating velocity and to reduce the loss of a catalyst during wet process. A catalyst precursor resin composition comprises 100 parts by weight of an organic polymer resin; 20-150 parts by weight of a multifunctional monomer having an ethylenically unsaturated bond; 1-25 parts by weight of a photoinitiator; 2-80 parts by weight of a silver ion complex precursor; and an organic solvent. Preferably the organic polymer resin is a copolymer of a monomer containing a carboxyl group and an unsaturated bond-containing monomer copolymerizable with the monomer containing a carboxyl group and has a weight average molecular weight of 2,000-30,000 and an acid number of 90-700 mg KOH/g.