| 摘要 |
A subsurface imaging using an electron beam is provided to be used for rear navigation without an exposed feature part or a front alignment when a reference point or other mark is blocked. A subsurface imaging by using an electron beam includes the steps of: thinning an element from a rear part thereof up to 200mum through CMP(Chemical Mechanical Polishing)(400); milling a hole of 200mum x 200mum size and 10 ~ 500mum depth(402); milling a hole of 1mum x 1mum size on the bottom of the 200mum x 200mum sized hole(404); and stopping milling, and inspecting the bottom of the 1mum x 1mum sized hole by using an energy electronic beam having enough energy to observe a feature part of the subsurface(406).
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