| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for optical communications whose connection reliability is high by reducing the connection loss between packaged optical parts and which is small-sized by integrating optical parts and electronic parts necessary for the optical communications by constituting the device of a printed circuit board for packaging an IC chip where an optical device is packaged at a specified position and a multilayer printed wiring board where an optical waveguide is formed at a specified position. <P>SOLUTION: The device for the optical communications is constituted of at least a printed board for packaging the IC chip possessing an area for packaging the optical device where the optical device is packaged and also a layer filled with resin for an optical path is formed and the multilayer printed wiring board where at least the optical waveguide is formed, so that an optical signal is transmitted with the optical waveguide and the optical device through the layer filled with the resin for the optical path. <P>COPYRIGHT: (C)2004,JPO |
