THIN-FILM PATTERN FORMING METHOD, DEVICE MANUFACTURING METHOD, ELECTROOPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To reduce contact resistance between upper and lower layers while ensuring adhesiveness of a conductive film pattern in forming a thin-film pattern of a multilayer wiring on a substrate by using a liquid drop jetting method. SOLUTION: The method of forming a thin-film pattern having a multilayer wiring has steps of: forming an insulating film on a base including a substrate and having a first pattern region having a conductivity on the substrate; forming a contact hole on the insulating film; and forming a bank for forming a second pattern region having a first wide portion and a second wide portion on a region including the contact hole, on the insulating film. COPYRIGHT: (C)2007,JPO&INPIT