| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which can clean the rear of a wafer without reversing the front and the rear of the wafer after cleaning the front surface of the wafer. SOLUTION: A chamber 100 for processing a wafer 102 has a ring 104 to separate the inner space of the chamber 100 into an upper portion 106 and a lower portion 108. The front surface 110 of the wafer 102 is located in the upper portion 106, the rear surface 112 is located in the lower portion 108. Thus, by separating with a ring 104 the region in which the rear surface 112 is located from the region in which the front surface 110 is located, it becomes possible to introduce an aimed process gas into the chamber 100 making the rear 112 only to be the object. More specifically, when cleaning the rear surface 112 of the wafer 102, it becomes possible to introduce the process gas into the lower portion 108 of the chamber 100 only. As the result, it becomes possible to clean the rear surface 112 of the wafer 102 without giving a large impact to the front surface 110 of the wafer 102. COPYRIGHT: (C)2007,JPO&INPIT |
