| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming apparatus and a film forming method, which form a film having satisfactory film quality and high stress. SOLUTION: In forming a film 41 on a substrate 6 placed on a supporting base 4, the chuck plate 21 of the supporting base 4 absorbs and holds the substrate 6 by electrostatic suction. The substrate 6 is bent into a convex or concave shape together with the absorbing surface of the chuck plate 21 for absorbing and holding the substrate 6. The film 41 is formed on the substrate 6 with the substrate 6 bent. After forming the film 41 on the substrate 6, bending of the absorbing surface of the chuck plate 21 is released, and bending of the substrate 6 is released. COPYRIGHT: (C)2007,JPO&INPIT |
