发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which eliminates the adverse effect of reflected light of a laser beam emitted to a fuse element on an adjacent fuse element. SOLUTION: In the semiconductor device provided with fuse elements that each comprise a metal wire layer and can be fused by laser emission, each of the fuse elements 9 comprises: a fusing metal part 11 that is fused through laser emission; and surrounding metal parts 13 arranged around the fusing metal part 11 and optically surrounding the fusing metal part 11. The surrounding metal parts 13 reflect reflected light of the laser beam emitted to a side face of the fusing metal part 11 toward the fusing metal part 11 by the surrounding metal part 13 and the reflected light is not leaked to outside the surrounding metal part 13. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007243075(A) 申请公布日期 2007.09.20
申请号 JP20060066800 申请日期 2006.03.10
申请人 RICOH CO LTD 发明人 OTSUKA MASAYA;HARIGAI ATSUSHI;OKAZAKI TAKASHI
分类号 H01L21/82;H01L21/822;H01L27/04 主分类号 H01L21/82
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