发明名称 |
HEAT RADIATOR PLATE OF COPPER OR COPPER-CONTAINED ALLOY, AND ITS JOINING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of joining a DBA substrate and a heat radiating member by brazing or by soldering, and also a heat radiator plate manufactured by the joining method. SOLUTION: A Cu plate or a Cu-contained alloy is joined to a foil or a particle-like Sn-based alloy by inserting the foil or the particle-like Sn-based alloy between the Cu or the Cu-contained alloy, and heating the alloys at a temperature not lower than the melting point of the Sn-based alloy. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007242891(A) |
申请公布日期 |
2007.09.20 |
申请号 |
JP20060063187 |
申请日期 |
2006.03.08 |
申请人 |
JFE SEIMITSU KK;JFE STEEL KK |
发明人 |
TERAO SEIMEI;OTA HIROKI;KOHIKI HIDEAKI |
分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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