发明名称 HEAT RADIATOR PLATE OF COPPER OR COPPER-CONTAINED ALLOY, AND ITS JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of joining a DBA substrate and a heat radiating member by brazing or by soldering, and also a heat radiator plate manufactured by the joining method. SOLUTION: A Cu plate or a Cu-contained alloy is joined to a foil or a particle-like Sn-based alloy by inserting the foil or the particle-like Sn-based alloy between the Cu or the Cu-contained alloy, and heating the alloys at a temperature not lower than the melting point of the Sn-based alloy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007242891(A) 申请公布日期 2007.09.20
申请号 JP20060063187 申请日期 2006.03.08
申请人 JFE SEIMITSU KK;JFE STEEL KK 发明人 TERAO SEIMEI;OTA HIROKI;KOHIKI HIDEAKI
分类号 H01L23/40 主分类号 H01L23/40
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