| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board wherein the thickness of its each substrate is made as thin as possible, and the warp and the deformation of its each substrate can be made as small as possible when subjecting it to a reflow. SOLUTION: The multilayer flexible printed wiring board (a multilayer FPC) 10 has an inner-layer substrate 11 having circuits on both the surfaces thereof, and has each outer-layer substrate 16 laminated on one of both the surfaces of the inner-layer substrate 11. Further, the interlayer continuity between the circuits of its each layer is performed by plating. In this multilayer FPC 10, a thickness B of each plating layer 18 of its each outer layer is set to the 100-200 percent of a thickness A of each plating layer 13 of its inner layer. COPYRIGHT: (C)2007,JPO&INPIT |
