| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which reduces radiation noise in a branched differential interconnection. <P>SOLUTION: The wiring board has N pairs of first branched interconnections, which are disposed in a first substrate and branched from a bus interconnection, N pairs of second branched interconnections which are disposed in a second substrate and electrically connected to the N pairs of first branched interconnections each and N-receiving elements, which are disposed in a third substrate and are electrically connected to the N pairs of second branched interconnections, respectively. The common mode impedance Z1 of the first branched interconnection and a common mode impedance Z2 of the second branched interconnection are related by the relation; 0.8×Z1≤Z2≤1.2×Z1. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
