| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer surface defect inspection device capable of reducing instrument errors of detection sensitivity and foreign matter coordinate detection error, and capable of obtaining high position coordinate precision for a defect such as a foreign matter, and a method therefor. SOLUTION: An emission light beam emitted from the first light source is illuminated on a surface of a rotating wafer to form a beam spot, scattered light resulting from the defect such as the foreign matter on the surface of the wafer is detected in a plurality of directions to be output as signals, vertical movement of the wafer surface is detected using a white light or broadband light from the second light source, a beam spot position on the wafer surface is corrected based on information therein to restrain a coordinate error accompanied to the vertical movement of the wafer surface, and the coordinate precision for the detected defect such as the foreign matter is enhanced by correcting an emission direction and an emission position of the light beam from the first light source to restrain a coordinate error resulting from fluctuation of the first light source. An illumination beam spot diameter is corrected further to restrain the instrument errors of the detection sensitivity and the foreign matter coordinate detection error. COPYRIGHT: (C)2007,JPO&INPIT
|
