Electronic component integrated module and method for fabricating the same

摘要

The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient alpha of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient alpha1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient alpha2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17x10⁶/° C. and not more than 110x10^-6/° C.