发明名称 PREDICTION METHOD AND APPARATUS FOR SUBSTRATE PROCESSING APPARATUS
摘要 A prediction method for a substrate processing apparatus is to predict processing results from operation data on the substrate processing apparatus during a procedure for processing a target processing substrate in a processing chamber of the substrate processing apparatus. The method includes the steps of: collecting operation data obtained; and obtaining a moving average of a preset number of sets of data using the processing result data collected at the data collection step. The method further includes the steps of: performing multivariate analysis using the operation data collected at the data collection step and the moving average processing result data obtained at the moving average processing step; and predicting processing results using operation data obtained when a target processing substrate, other than the target processing substrate used to obtain the correlation at the analysis step, is processed on a basis of the correlation.
申请公布号 US2007215574(A1) 申请公布日期 2007.09.20
申请号 US20070684298 申请日期 2007.03.09
申请人 TOKYO ELECTRON LIMITED 发明人 TANAKA HIDEKI
分类号 G01L21/30;G06F17/50 主分类号 G01L21/30
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