Photosensitive, thermosetting resin composition, used e.g. as a soldering resistance film, comprises silane-modified epoxy resin, polycarboxylic acid resin, diluent, light-polymerization initiator and hardening-adhesion promoter

摘要

Photosensitive, thermosetting resin composition (A) comprises an alkoxy group-containing silane-modified epoxy resin (I) obtained from an alcohol withdrawal reaction of an epoxy resin (Ia) with a water-soluble alkoxy silane; a polycarboxylic acid resin (II) containing unsaturated groups; diluent (III) (50-500 parts by weight); light-polymerization initiator (IV) (0.1-30 parts by weight); and a hardening-adhesion promoter (V) (0.1-20 parts by weight, based on the total quantity of 100 parts by weight of (I) and (II)). Photo-sensitive, thermo-setting resin composition (A) comprises an alkoxy group-containing silane-modified epoxy resin (I) obtained from an alcohol withdrawal reaction of an epoxy resin (Ia) of formula (GO-[A11-OCH 2-CH(OA12)-CH 2-O] a-[A13-OCH 2-CH(OA14)-CH 2-O] b-A15-OG) with a water-soluble alkoxy silane; a polycarboxylic acid resin (II) containing unsaturated groups and exhibiting ethylene groups in the unsaturated molecules and two or more carboxyl groups and an acid number of 50-150 mg potassium hydroxide/g; diluent (III) (50-500 parts by weight); light-polymerization initiator (IV) (0.1-30 parts by weight); and a hardening-adhesion promoter (V) (0.1-20 parts by weight, based on the total quantity of 100 parts by weight of (I) and (II)); where the weight ratio of the content of (I) and (II) is 2/100 to 50/100. G : a glycidyl group; A11, A13, A15 : a bivalent aromatic residue or a bivalent, hydrogenated aromatic residue group; A12, A14 : H (preferred) or G; and either a, b : greater than 0 (where a and b are not equal to 0 at the same time); or a+b : = 20. Independent claims are included for: (1) a method for producing a resist-film coated, smoothened, printed circuit board comprising applying (A) on the surface of a smoothened printed circuit board, photo-hardening the applied resin and subsequent heating at 100-190[deg]C for thermo-setting; and (2) a resist-film coated, smoothened, printed circuit board, which is produced by the method.