发明名称 FILM FORMING METHOD OF SHIELD FILM BY SPUTTERING AND FORMED SHIELD FILM
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a shield film of an electromagnetic wave having excellent shield characteristics and excellent economic efficiency and productivity by sputtering, and formed shield film. SOLUTION: An object is to form on a substrate 2 a shield film 1 of at least three layers composed of an adhesive film 3, a conductive film 4, and a protective film 5, by using a sputtering apparatus including a vacuum chamber, a plurality of targets, and an electric power circuit connected to the targets, and particularly the adhesive film 3 and the protective film 5 are formed of SuS. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007243122(A) 申请公布日期 2007.09.20
申请号 JP20060103623 申请日期 2006.03.06
申请人 BE-SPPUTER CO LTD 发明人 DATE TETSUYA;DATE HIROYUKI
分类号 H05K9/00;B32B15/08;C23C14/14;C23C14/34 主分类号 H05K9/00
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