发明名称 Wired circuit board and connection structure between wired circuit boards
摘要 A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.
申请公布号 US2007218781(A1) 申请公布日期 2007.09.20
申请号 US20070717706 申请日期 2007.03.14
申请人 NITTO DENKO CORPORATION 发明人 YOKAI TAKAHIKO;NAITO TOSHIKI;OOYABU YASUNARI
分类号 H01R13/514 主分类号 H01R13/514
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