| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a protective coating for a semiconductor device or the like which generates a reduced amount of a volatile component when heated at a lower temperature than a conventional temperature, e.g., at 200°C. <P>SOLUTION: A photosensitive resin composition is used which contains polyamide and an isocyanuric acid derivative having photopolymerizable unsaturated bonds represented by formula (3) as essential components. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007241195(A) |
申请公布日期 |
2007.09.20 |
| 申请号 |
JP20060067464 |
申请日期 |
2006.03.13 |
| 申请人 |
ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
DOI ICHIRO;MATSUDA HIDEKI;SEO ATSUSHI;ANZAI NOBUHIRO |
| 分类号 |
G03F7/027;C08F290/14;H01L21/027 |
主分类号 |
G03F7/027 |
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