发明名称 |
MANUFACTURING METHOD OF LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device capable of reducing color irregularity and costs. <P>SOLUTION: A structure shown by Fig. 1(b) is obtained by performing a resin coating process for forming a non-cured resin layer 2a that is a non-cured resin layer by coating resin (for example, a silicone resin) having light transmission properties on a light extraction surface 1a in an LED chip 1 shown in Fig. 1 (a). A structure shown in Fig. 1 (c) is obtained by performing a blast process for forming a non-cured resin layer 2b without containing any phosphors by spraying the phosphors to the non-cured resin layer 2a for injection from the surface side of the non-cured resin layer 2a after the resin coating process. The light emitting device in a structure shown by Fig. 1 (d) is obtained by performing a resin curing process for forming a color conversion layer 3 by curing the non-cured resin layer 2b containing phosphors after the blast process. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007243053(A) |
申请公布日期 |
2007.09.20 |
申请号 |
JP20060066408 |
申请日期 |
2006.03.10 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
HAYASHI TAKAO;TANAKA KENICHIRO |
分类号 |
H01L33/50;H01L33/48;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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