| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability of connection between a substrate 8 and an electronic component 9 in a module component 7. <P>SOLUTION: The module component 7 is arranged between a side surface of a connecting electrode 10 and a sealing resin 11, and includes an expansion pressure absorber 12 having an elasticity lower than that of the sealing resin 11. This structure mitigates rise of internal pressure due to re-fusing of the connecting electrode 10 because the expansion pressure absorber 12 is deformed as arranged between the side surface of the connecting electrode 10 and the sealing resin 11, in the case where the module component 7 is mounted on a circuit board with the solder reflow system. Accordingly, outflow of the connecting electrode 10 from the interface separated between the sealing resin 11 and the substrate 8 can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
