| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board wherein heat stress is not applied on wiring as much as possible. <P>SOLUTION: The flexible printed circuit board is provided for mounting a semiconductor chip by using a no-flow underfill material as a sealing material. A covering film 20 covers a front plane of the flexible printed circuit board 10, and the edge of the covering film 20 close to the semiconductor chip 30 is arranged at a position inside an outer-shape profile projection line P of the semiconductor chip. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
