摘要 |
PROBLEM TO BE SOLVED: To provide a resin layer forming device and a method in which flat and uniform layer thickness can be secured efficiently and defective sticking is not caused. SOLUTION: The device has a base mount part 1, a cavity provided at the base mount 1 and prescribing area corresponding to a protection layer, an application part 4 supplying resin R in the cavity, a pressing part 5 pressing resin R supplied in the cavity, an irradiation part 6 in which when pressing by the pressing part 5 is performed, the resin R pressed by a vacuum source evacuating a space between the resin R and the pressing part 5 and the pressing part 5 is cured, and a sticking part 7 sticking a substrate S to the resin R cured by the irradiation part 6. COPYRIGHT: (C)2007,JPO&INPIT
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