发明名称 PRESSURE SENSOR, PRESSURE SENSOR PACKAGE, PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a pressure sensor with a structure being hard to receive any stress from outside and functioning as a gage pressure sensor. SOLUTION: The pressure sensor 10 uses a plate-like semiconductor substrate 12 as a base material, comprises a space (reference pressure chamber) 13 which is formed inside the central regionαon one surface of the semiconductor substrate 12 so as to expand in approximately parallel with the one surface, and uses a thinned region as a diaphragm part 14 positioned on one side of the space 13. A plurality of pressure-sensitive elements 15 are arranged on the diaphragm part 14, and conductive parts 16 which are electrically connected with respective pressure-sensitive elements 15, are arranged on an outer edge regionβof the above-mentioned one surface except the diaphragm part 14. Furthermore, an opening part 17 is disposed on the other side of the space 13, which opens to the other surface of the semiconductor substrate 12 and makes the space 13 communicated with the outside of the semiconductor substrate 12. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007240250(A) 申请公布日期 2007.09.20
申请号 JP20060061016 申请日期 2006.03.07
申请人 FUJIKURA LTD 发明人 YAMAMOTO SATOSHI;HASHIMOTO MIKIO;SUZUKI TAKANAO
分类号 G01L9/00;H01L29/84 主分类号 G01L9/00
代理机构 代理人
主权项
地址