发明名称 ELECTROPLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electroplating apparatus having a simple power feeding structure, easy in the peeling off of a metal deposited on a power feeding means and capable of eliminating an non-plated part and plating even on a lead wire of an axial electronic component. SOLUTION: The power feeding to a part to be plated is carried out by using a power feeding wire 2 of a wire shaped conductor as a power feeding electrode for turning the lead wire of the axial electronic component 6 to be plated into a cathode and bringing a part of the power feeding wire 2 arranged in a plating bath 5 into contact with the lead wire of the axial electronic component 6. The plating metal deposited on the power feeding wire 2 is peeled off by dies 3. The power feeding wire 2 has an endless structure to repeatedly and continuously to be used after the plated metal deposited on the power feeding wire 2 is peeled off and a power feeding wire feeding pulley 1 is provided as a feeding mechanism of the power feeding wire 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007238995(A) 申请公布日期 2007.09.20
申请号 JP20060061140 申请日期 2006.03.07
申请人 NEC TOKIN CORP 发明人 KITAJIMA AKIRA
分类号 C25D17/10;C25D7/00;C25D17/00;C25D21/00 主分类号 C25D17/10
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