| 摘要 |
A heat dissipation device includes a heat sink ( 30 ) and a heat pipe ( 40 ) thermally attached to the heat sink. The heat sink includes a base ( 32 ) with an opening ( 3262 ) defined therethrough, and a plurality of fins ( 36 ) mounted on the base. The heat pipe comprises an evaporating portion ( 42 ) and a condensing portion ( 44 ) thermally connecting with the fins. The evaporating portion comprises a flat bottom surface ( 422 ) for directly contacting with an electronic unit ( 50 ) and an arc-shaped top surface ( 424 ) contacting with the fins at the opening of the base.
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