发明名称 PATTERN TRANSFER BY SOLID STATE ELECTROCHEMICAL STAMPING
摘要 <p>The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected anodized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools of the present invention are capable high throughput patterning of large substrate areas and, thus, enable a robust and commercially attractive manufacturing pathway to a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices and integrated electronic circuits.</p>
申请公布号 WO2007106911(A2) 申请公布日期 2007.09.20
申请号 WO2007US64132 申请日期 2007.03.16
申请人 THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS;RAPAKA, VENKATA K.;FANG, NICHOLAS X.;FERREIRA, PLACID M.;HSU, KENG HAO;SCHULTZ, PETER L. 发明人 FANG, NICHOLAS X.;FERREIRA, PLACID M.;HSU, KENG HAO;SCHULTZ, PETER L.
分类号 C25D5/02 主分类号 C25D5/02
代理机构 代理人
主权项
地址