发明名称 |
FLEXIBLE CIRCUITS AND METHOD OF MAKING SAME |
摘要 |
Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.
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申请公布号 |
KR20070094607(A) |
申请公布日期 |
2007.09.20 |
申请号 |
KR20077013939 |
申请日期 |
2007.06.20 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
DASARATHA SRIDHAR V.;MCHATTIE JAMES S.;SHIRCK JAMES R.;YAMAZAKI HIDEO;HIROSHIGE YUJI;SEKIGUCHI MAKOTO |
分类号 |
H05K3/06 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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