发明名称 FLEXIBLE CIRCUITS AND METHOD OF MAKING SAME
摘要 Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.
申请公布号 KR20070094607(A) 申请公布日期 2007.09.20
申请号 KR20077013939 申请日期 2007.06.20
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 DASARATHA SRIDHAR V.;MCHATTIE JAMES S.;SHIRCK JAMES R.;YAMAZAKI HIDEO;HIROSHIGE YUJI;SEKIGUCHI MAKOTO
分类号 H05K3/06 主分类号 H05K3/06
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