| 摘要 |
A method for fabricating a microstructure having thin parts (T1-T3) comprising a step for forming pre-thin parts (T1'-T3') abutting, in a second conductor layer (12), on a first conductor layer (11) while having a pair of side faces spaced apart in the in-plane direction of the second conductor layer (12) by etching a material substrate having a multilayer structure of the first conductor layer (11) and the second conductor layer (12) having a thickness corresponding to that of the thin parts (T1-T3) starting on the first conductor layer (11) side, and a step for forming the thin parts by removing the parts of the first conductor layer (11) abutting on the pre-thin parts (T1'-T3') by performing second etching starting on the first conductor layer (11) side.
|
