| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely prevent failure generation in the case of the soldering operation of a heat spreader concerning a semiconductor package structure. <P>SOLUTION: The semiconductor package structure is provided with a semiconductor chip 2 mounted on a package substrate 1 and a heat spreader 3 soldered to an opposite face to the circuit face of the semiconductor 2. A frame-shaped solder dam 4 surrounding a region including the semiconductor chip 2 from a plane view is formed on a junction surface between the heat spreader 3 and the semiconductor chip 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
