| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heat processing apparatus with a carrier plate in which heat distribution on a substrate is uniform during heat processing, and a micro-crack and a fracture in the substrate hardly occur. SOLUTION: The substrate heat processing apparatus comprises the carrier plate 10A for holding and carrying, for example, a glass substrate 20. The carrier plate 10A has a plurality of holders 35 for partially contacting the outer periphery ends of the substrate 20 from the outer periphery side of the substrate 20 to hold them. The carrier plate 10A may comprise a frame 11 having a central opening 12 larger than the outer shape of the substrate 20, and the holders 35 may be provided to project from the frame such that the holders 35 overlap on a plane part of the outer periphery end of the substrate 20. COPYRIGHT: (C)2007,JPO&INPIT |
