| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an imaging element capable of avoiding deposition of foreign matters in a simple structure, and to provide the imaging element. SOLUTION: The manufacturing method of the imaging element includes (1) a step of forming a microlens 18, (2) a step of forming a flat layer 19 entirely on a semiconductor substrate with the microlens formed, by using an application liquid of transparent resin with a lower refractive index than that of the microlens, (3) a step of forming a resist pattern 24, having an effective image region of the flat layer covered and an opening on an aluminum pad, and (4) a dry-etching step of removing the flat layer above the aluminum pad to form an opening 25, having the aluminum pad exposed and concurrently removing the resist pattern. COPYRIGHT: (C)2007,JPO&INPIT |
