| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element with which mechanical strength of a semiconductor substrate (wafer) at the time of work can be secured, a work upper limit temperature can be raised, a diffusion layer can easily be formed, work cost can be reduced in a simple process, and occurrence of dust by dicing can be controlled; and to provide the semiconductor substrate. SOLUTION: In the method of manufacturing the semiconductor element, the semiconductor substrate (wafer 1) is used having a thin plate 2 constituting the semiconductor element (chip 30) and a thick plate 3 projected from one face in a thickness direction with respect to the thin plate 2. The method has a process for manufacturing an element structure (rear-side element structure 25) on a face of a side to which the thick plate 3 in the thin plate 2 projects, a process for filling a part between the thin plate 2 and the thick plate 3 with an adhesion material (adhesive 26), and a dicing process for making the thin plate 2 into pieces and separating them from the thick plate 3. COPYRIGHT: (C)2007,JPO&INPIT
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