| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method capable of quickly and uniformly processing whole surface areas of substrates in a batch thermal processing to a desired temperature. SOLUTION: The apparatus 100-6 which carries out the thermal processing of the substrates 108 held in a carrier 106 is equipped with a transverse flow liner 232 improving uniformity of gas flow over the whole surface area of each of the substrates. The transverse flow liner has a longitudinal tube swelling segment 262 for containing a transverse flow filling system 250. The transverse flow liner has a shape the same as that of the wafer carrier, therefore clearances between the transverse flow liner and the wafer carrier is decreased, wherein a pattern is developed and dimensions are determined in such away that vortexes or stagnations in these clearance regions are decreased or eliminated. COPYRIGHT: (C)2007,JPO&INPIT
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