| 摘要 |
PROBLEM TO BE SOLVED: To form a coated film such as a flat insulating film on a substrate like a wafer without using a chemical mechanical polishing (CMP) device. SOLUTION: A substrate processing system 1 is provided with planarizing equipment 18 that hardens a coated insulating film A before it is hardened in a heating furnace. The planarizing equipment 18 has a spin chuck 71 that holds and rotates a wafer W, a brush 101 that is pressed against the coated insulating film A on the wafer W to grind the surface of the coated insulating film A, a first arm 81 for moving the brush 101 along the surface of the wafer W, a working liquid supply nozzle 110 supplying a working liquid onto the wafer W, and so on. The wafer W having the coated insulating film A in a soft state before being hardened is conveyed to the planarizing equipment 18, and the brush 101 is moved along the surface of the coated insulating film A while it is pressed against the coated insulating film A, thus planarizing the coated insulating film A to a predetermined film thickness. COPYRIGHT: (C)2007,JPO&INPIT
|
