发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which can uniformize a temperature distribution in a substrate to be treated, and simultaneously can prevent a crack on a substrate to be treated. SOLUTION: The vapor deposition apparatus comprises: the substrate 11 to be film-formed thereon; a substrate heater 15 for heating the substrate 11 to be treated; a soaking member 9 which is arranged in between the substrate 11 to be treated and the substrate heater 15, and uniformizes the temperature of the surface of the substrate 11 to be treated; and a substrate holder 12 which holds the substrate 11 to be treated while directing the surface to be film-formed vertically downward and holds the soaking member 9, all arranged in chamber 1. A gap 25 is formed in between the substrate 11 to be treated and the soaking member 9. The substrate holder 12 has an exposed portion 40, which does not contact with the soaking member 9, on the soaking member retention surface 41 for retaining the soaking member 9 in the substrate holder 12. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007238966(A) 申请公布日期 2007.09.20
申请号 JP20060058595 申请日期 2006.03.03
申请人 SHARP CORP 发明人 OKADA TOSHINORI
分类号 C23C16/46;H01L21/205 主分类号 C23C16/46
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