MOLD RELEASE FILM

摘要

PROBLEM TO BE SOLVED: To provide a mold release film suppressed in its peeling charge and friction charge without separately providing an antistatic layer and a mold release layer, reduced not only in the adsorption of dust but also in peeling charge at the time of drawing out of the film, hard to cause friction charge, capable of stably keeping peeling force and suppressed in the transfer to an opposite surface at the time of resin processing. SOLUTION: The mold release layer satisfies a relation of 0.25H≤L≤0.5H+2.5 in its heavy surface peel strength H (mN/cm width) and light surface peel strength L (mN/cm width) and has its initial residual adhesion ratio of 80% or above and its residual adhesion ratio with the elapse of time after the mold release film of 80% or above under a temperature (60°C)/humidity (90%) condition. The layer is provided on both sides of a polyester film. At this time, a conductive substance is added so that the surface resistivity value of at least one conductive layer becomes 1×104-below 1×1013Ω/SQARE. COPYRIGHT: (C)2007,JPO&INPIT