| 摘要 |
Manufacturing processes of a leadframe-based BGA package and a leadless leadframe implemented in the processes are disclosed. The leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process is performed to remove the bottom leads to make the top soldering pads electrically isolated, exposed and embedded in the encapsulant for solder ball placement where the soldering area of the top soldering pads is defined without the need of solder mask(s) to solve the diffusion of solder balls on the leads during reflow. Moreover, mold flash can easily be detected and removed. The overall package cost can be reduced.
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