Thermosetting composition and film having a layer comprising the composition

摘要

A thermosetting composition comprising (A) an organopolysiloxane and (B) a curing catalyst, characterized in that the organopolysiloxane (A) has at least two alkenyl groups per molecule and a phenyl group in an amount of from 10 to 99% of whole substituents bonded to silicon atoms of the organopolysiloxane, and softens or melts at a temperature of from 30° C. to a temperature lower than an onset temperature of heat curing of the composition.