| 摘要 |
A semiconductor batch heating assembly is provided to apply common high-current/low-voltage power to heaters by selecting the proper number of heaters and mounting the heaters in series. A chamber has an interior for placement of a wafer boat containing a plurality of shelves for supporting a wafer substrate. At least one heater is positioned outside the chamber, and has an interior side facing the chamber and transmitting heat energy to the chamber to heat the wafers contained therein, and an exterior side. At least one heat shield layer is disposed on the exterior side of the heater, and at least a metalized insulating layer is disposed outside the heat shield layer. The heater has at least one resistive heating element(6a to 6c) patterned in plural circuits defining at least one zone for independently controlling heating of the at least zone. |
