发明名称 Designing a plated pattern in printed wiring board
摘要 The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the plating areas and judging whether or not the plating area has any variance, and conducting a design change, on patterns contained in this zone, to eliminate the variance.
申请公布号 US2007202246(A1) 申请公布日期 2007.08.30
申请号 US20070790665 申请日期 2007.04.26
申请人 FUJITSU LIMITED 发明人 NII MOTOHARU
分类号 C25D5/02;C25D7/00;C25D21/12;H05K3/00;H05K3/24 主分类号 C25D5/02
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