| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus capable of performing the processing with the minimum amount of a processing gas according to the number of wafers to be processed even in a batch system. SOLUTION: By moving a partition 21 in the vertical direction of a chamber 1, an area 4a on one side according to the number of wafers 8 to be processed is set. A processing gas is fed by a three-way valve 13 from a feed pipe 11 opened in a processing chamber 4 of the area 4a on one side, N<SB>2</SB>gas is fed from the feed pipe 11 opened in the processing chamber 4 of an area 4b on the other side. The wafers are processed by using the processing gas of the amount corresponding to the number of wafers 8 to be processed. COPYRIGHT: (C)2007,JPO&INPIT
|
