| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit package system having a die on a base package. <P>SOLUTION: An integrated circuit package system (100) having a die on a base package is formed through steps including: formation of a base package (122) including forming a substrate (102), mounting a first integrated circuit (108) on the substrate (102), enclosing the integrated circuit (108) and the substrate (102) by a molding compound (120), and testing the base package (122); adhesion of a bare die (126) to the base package (122); electrical connection of the bare die (126) to the substrate (102); and enclosure of the bare die (126) and the base package (122). <P>COPYRIGHT: (C)2007,JPO&INPIT |
