| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package by assembling inductors, capacitors and resistors to wiring on a semiconductor substrate so as to facilitate high density mount, and to provide a manufacturing method thereof. <P>SOLUTION: The semiconductor package 1 at least includes: the semiconductor substrate 10 on one principal side of which electrode pads 11a and a passivation film 12 are formed, a first insulation film 20 provided in a way of covering the semiconductor substrate 10, a re-wiring layer 30 provided on the first insulation layer 20, and a second insulation film 40 provided in a way of covering the first insulation film 20 and the re-wiring layer 30. In the semiconductor package 1, the inductors 3 and the resistors 4 are formed to the re-wiring layer 30, the capacitors 2 with a 3-layer structure comprising a lower electrode 2a/a dielectric layer 2b/an upper electrode 2c are formed on the electrode pads 11a, and the capacitors 2 are electrically connected to the re-wiring layer 30 through an opening 21a formed to the first insulation film 20. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
