| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device such that information regarding the semiconductor device can be prevented from easily being recognized by unspecified persons, and to provide a method of manufacturing the same. SOLUTION: The semiconductor device 1 comprises a package main body 11, an external lead terminal 12 extending from the package main body 11 to outside the package main body 11, a mark 14 which is provided on the external lead terminal 12 and represents the information regarding the semiconductor device 1, and a plating film 13 which covers at least the part of the external lead terminal 12 where the mark 14 is provided. COPYRIGHT: (C)2007,JPO&INPIT
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