发明名称 SUBSTRATE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To make it possible to collectively carry out by the same etching solution a wet-etching of a metal film consisting of silver or a silver alloy making silver a principal component and a protective film, in a substrate with a laminated structure and a method of manufacturing the substrate with the laminated structure. SOLUTION: A substrate 10 with the laminated structure is constituted by forming at least a metal film 31 and a protective film 32 on a front surface of a substrate 20 in this order. The metal film 31 consists of silver or the silver alloy making silver the principal component, and a thickness of the protective film 32 is 8Åor more and 32Åor less, and the wet-etching of the metal film 31 and the protective film 32 can be collectively carried out by the same etching solution. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220965(A) 申请公布日期 2007.08.30
申请号 JP20060040997 申请日期 2006.02.17
申请人 FURUYA KINZOKU:KK 发明人 WATANABE ATSUSHI
分类号 H01L21/3213;H01B13/00;H01L21/306;H01L21/3205;H01L23/52 主分类号 H01L21/3213
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