| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method where a hypereutectic type aluminum-silicon alloy or a composite material comprising the alloy can be soldered, and to provide a plated product. SOLUTION: In the plating method for a hypereutectic type aluminum-silicon alloy or a composite material comprising the alloy, the surface of a rapidly solidified hypereutectic type aluminum-silicon alloy or a composite material comprising the alloy is subjected to etching treatment with alkali, then, an Ni-P electroless plating layer is formed thereon, and an Ni-B electroplating layer is formed thereon. The plated product is composed using the same. COPYRIGHT: (C)2007,JPO&INPIT
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