发明名称 TAPING PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a taping package which can stabilize mounting of a micro-sized electronic component. SOLUTION: The taping package includes a carrier tape 11 having a plurality of through-holes 13, a bottom tape 14 provided on one side of the carrier tape 11 so as to close the through-holes 13, a middle tape 16 provided on the other side of the carrier tape 11 so as to close in the through-holes 13, and a top tape 17 provided on the other side of the carrier tape 11 so as to cover the middle tape 16. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007216975(A) 申请公布日期 2007.08.30
申请号 JP20060036288 申请日期 2006.02.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAMURA MOTOHISA
分类号 B65D85/86;B65D73/02 主分类号 B65D85/86
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