| 摘要 |
The invention relates to a component arrangement comprising a semiconductor component having a semiconductor body ( 100 ), and comprising a temperature measuring arrangement for determining a temperature at a specific position ( 20 ) in the semiconductor body, which comprises the following features: a temperature sensor ( 10 ) integrated in the semiconductor body ( 100 ), said temperature sensor being designed to generate a first temperature signal (V 10 ) dependent on a temperature in the semiconductor body ( 100 ), a control device comprising a control amplifier ( 40 ), which has a first and a second input ( 41, 42 ) and an output ( 43 ), and comprising a low-pass filter ( 50 ) having an input ( 51 ) and an output ( 52 ), the input ( 51 ) of the low-pass filter ( 50 ) being coupled to the output ( 43 ) of the control amplifier ( 40 ), the first input of the control amplifier ( 40 ) being coupled to the temperature sensor ( 10 ) and the second input ( 42 ) of the control amplifier ( 40 ) being coupled to the output ( 52 ) of the low-pass filter ( 50 ), an output, which is coupled to the output of the control amplifier ( 40 ) and at which a second temperature signal (V 40 ) is available. The invention additionally relates to a method for determining the temperature in a semiconductor component.
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