| 摘要 |
A method of packaging one or more semiconductor dice ( 10 ) includes providing a heat spreader ( 12 ) and attaching a first semiconductor die ( 10 ) to the heat spreader ( 12 ). A first set of bumps ( 14 ) is formed on respective die pads on a top surface ( 16 ) of the first die ( 10 ) and at least a second set of bumps ( 18 ) is formed on the first set of bumps ( 14 ) such that stacks of bumps ( 20 ) are formed on the top surface ( 16 ) of the first die ( 10 ). A molding process is performed such that a mold compound ( 24 ) is formed over the one or more dice ( 10 ), the stacks of bumps ( 20 ) and a portion of the heat spreader ( 12 ), which forms a semiconductor package ( 26 ).
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